Specifications of AG-Xplus SC (short-column type)
Shimadzu new AG-Xplus SC enables carry out variety of static tests including peeling tests, bending tests of printed circuit boards, chip tensile tests, IC shearing tests, electronic component withdrawal tests, PC card insertion and removal tests, etc.
Features
- High stiffness and compact frame
- Approaches the true values by high speed sampling
- High quality product. (JSCC approved)
- Test force accuracy guaranteed within ±0.5 % from 1/100 to 1/1000 load cell capacity
- Ideal for various material tests at a wide range of test speeds
Specification
| Load Capacity | 10 N, 20 N, 50 N, 100 N, 500 N, 1 kN, 5 kN, 10 kN | |
| Test Speed | 0.0005 to 1000 mm/min | |
| Test Speed and Allowable Test Force | All speeds can be used in each allowable load range | |
|
Size Width x depth x height (mm) |
777 x 510 x 1130 | |
Objects of Evaluation
Static strength, pharmaceuticals, cosmetics, electronic and electrical equipment, electronic components, mounted printed circuit boards, printed circuit boards, springs, automotive components, ceramic materials and components, metals and machinery.
Silicon chip bending test jig
This is a 3-point bending test jig for testing single IC chips such as silicon IC chips.
This is a 3-point bending test jig for testing single IC chips such as silicon IC chips.
* The external appearance and specification may be changed without notice for improvement.
This page may contain references to products that are not available in your country.
Please contact us to check the availability of these products in your country.
